Processing
Processing/Clean Room
Semiconductor device processing is carried out in a 4,000 square foot class-100 cleanroom in the ASU NanoFab facility.
List of major equipments and systems
Tempress 8-stack furnace tubes configured for: wet and dry thermal oxidation; poly-silicon, low temperature oxide and silicon nitride CVD; phosphorus and boron doping; and the annealing of 4” silicon wafers.Heidelberg DWL 66 Mask Making and Optical Direct-WriteKarl Suss…